Electronics Forum | Thu Feb 22 09:56:21 EST 2001 | blnorman
An adhesive, is an adhesive, is an adhesive. Yes most will thin when exposed to elevated temperature, but that's only for a short time. As cross-linking starts, viscosity increases. Having made countless numbers of adhesively bonded samples in the
Electronics Forum | Mon Aug 02 11:21:29 EDT 2004 | sforman1
Use MicroCoat Technologies UV cure solder mask. will leave PCB absolutely clean. used in many PCB solder/wirebonding apps. http://www.m-coat.com
Electronics Forum | Thu Mar 11 13:09:52 EST 2021 | processman
Hello, Hoping for some help, we have Hesse BJ820 wirebond machine and after changing to new spool of wire the wire snaps after first bond. Anyone have any idea ? Wire is in date and no change in machine setup, just change spool of wire.
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Thu May 28 03:18:22 EDT 2009 | cunningham
We use an epoxy method at the moment but the cure times are long with 4 hours oven cure and 4 hours air cure before solder can be applied to the pad the hot press bonds the already made epoxy pad to the board in less than 5 min and is ready to solde
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Sun Mar 14 20:49:02 EDT 2021 | davef
Where is the break occurring? What kind of wire are you using? What type of bonds are you making?
Electronics Forum | Mon Feb 06 22:45:59 EST 2006 | pyramus
Hi everybody! Just want to ask some recommendation if which epoxy is advisable to be used for bonding and underfill for BGA's at Lead Free Process. Currently, we only used Loctite 3515 for high temp curing for leaded process. How about for Lead fre
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Thu Jul 03 13:10:39 EDT 2003 | slthomas
I snapped a board in half at a cracked solder joint, and the component pulled free of the solder and still has a very thin layer of metal on the termination end. Based on the construction spec.(solder over nickel over palladium), it looks like it
