Electronics Forum: snap-off speed (Page 1 of 4)

Solder paste process

Electronics Forum | Thu Apr 30 13:09:53 EDT 2009 | scottp

One factor I see missing is separation speed (or snap off speed). I've run experiments with different pastes where it was the biggest factor in standard deviation of print volume for small apertures.

Solder Paste Printing

Electronics Forum | Wed Apr 14 13:39:08 EDT 2021 | SMTA-64387124

I am working with a CM in Taiwan and we are seeing significant differences between the paste printing bon the forward stroke vs the backward stroke. Print parameters are the same (pressure, speed, snap off speed) but there is a significant difference

MPM AP25, separation problems

Electronics Forum | Fri Oct 28 08:37:06 EDT 2005 | pavel_murtishev

Once again, it isn�t the process problem. It�s machine problem. I�ve tried to change all of the parameters: printing speed, printing pressure, snap-off speed, snap-off distance, etc. No any effect. Defect still exists with different process parameter

Solder Balls at component side around Pin in Paste components

Electronics Forum | Mon Nov 17 14:42:02 EST 2014 | tombstonesmt

Sounds like your snap off profile needs adjustment. More than likely there is paste under the stencil being transferred over to the board. Try adding a cleaning cycle after every board to determine if this is the issue. If the solder balls go away af

Fine pitch paste release problems.

Electronics Forum | Fri Dec 20 04:07:25 EST 2002 | Roger

Although everything that has been said earlier is sound advice for achieving good printing results, I strongly believe your problem is your manual printer and its inability to accurately control the speed at which the PCB separates from the stencil a

Printing Speeds for Fine Pitch

Electronics Forum | Wed Sep 01 12:58:42 EDT 2010 | scottp

A good paste will print fine up to 5 in/sec or so. They key, as mentioned, is to get the pressure right for a given squeegee speed. If the squeegees aren't giving a clean wipe then you'll see huge variation in print volume which can lead to shortin

stencil printing SPC

Electronics Forum | Tue Mar 15 19:17:26 EST 2005 | yoman

Thanks for your reply. We are using EKRA E4 Inline Automatic Stencil Printer. It is Capable of Automatic stencil inspection. 2D solder coverage inspection. Fix Squeegee angle at 45 degees angle. Programmable squeegee speeds and pressure, boards snap

Problems with .45 mil ball diameter BGA....

Electronics Forum | Fri Apr 29 17:49:22 EDT 2005 | Woodsmt

I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r

Problems with .45 mil ball diameter BGA....

Electronics Forum | Fri Apr 29 17:49:26 EDT 2005 | Woodsmt

I have used many of these devices recently and have used them several times over the last few years. I have been successful using a type 4 paste on a 5 mil stencil. The 13 mil round aperture should provide you with an area ratio just adequate for r

Solder Paste Volume

Electronics Forum | Mon Apr 09 13:28:06 EDT 2001 | slthomas

I've been wondering if I was the only person thinking this. There are so many print parameters that are programmable now on new machines (squeegee pressure, height, speed, snap-off settings, cleaning intervals) that the process would (in my oh-so-hu

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