Electronics Forum | Tue May 27 11:59:14 EDT 2003 | blnorman
Is anyone aware of any reports, studies, articles on the subject of silicon contamination in SnPb solder joints. We are evaluating repair of conformally coated (silicone) boards. The fear is that we will never totally remove the silicone and once i
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Thu Sep 21 21:00:21 EDT 2000 | Dave F
Well, I'm going to assume you: * Have a nichel barrier between the copper on your board and the gold / solder solution * Use a lead / tin near euthectic solder If so, I pick "C" - It doesn't matter. When concerned about copper tin intermetallics, t
Electronics Forum | Tue Feb 08 11:09:44 EST 2005 | jdumont
Hi all, we're preparing for the switch to lead free and I was wondering how dangerous/harmful to our new wave oven it would be to run tin lead parts through the no lead wave. Will the lead build up and cause issues?
Electronics Forum | Fri Sep 22 05:33:59 EDT 2000 | Wolfgang Busko
That "C - it doesn�t matter" choice sounds good because it doesn�t give you a headache when profiling but it gives me a headache when I read the article in the current "newsletter" about profiling where I found this: "If soldering to gold over nick
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Tue Aug 31 19:50:44 EDT 2004 | davef
To take our turn at keeping everyone else on the straight and narrow. For more on lead contamination of no-lead solder, look here: http://www.aimsolder.com/techarticles/Lead%20Contamination%20in%20Lead-Free%20Electronics%20Assembly.pdf [We apolog
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Tue Dec 13 14:55:12 EST 2005 | muse95
Your response is from the point of view of using a Bismuth solder with Pb plated leads. Samir's point of view is from Bismuth in the plating on the leads being used with a Pb solder. There is a very large difference in the amount of Bi that will en
Electronics Forum | Tue Oct 23 10:41:36 EDT 2012 | blnorman
Ideally first you need to analyze the residue to see what it is. We had a customer with white residues after wave and elemental analysis revealed tin.
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