Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong
Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,
Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter
Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.
Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold
Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.
Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB
As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p
Electronics Forum | Wed Sep 14 07:30:57 EDT 2005 | davef
What is a soak test? Do you mean a recipe for removing moisture from a board?
Electronics Forum | Tue Sep 13 06:00:29 EDT 2005 | Charlie
Was it possible to calculate Soak Test Equivalent on PCBA? For example: Soak Test at 60C/80%RH equivalent to how many hour of test at 25C/60%RH ?
Electronics Forum | Mon Apr 11 06:37:59 EDT 2005 | amstech
As long as you have a continuous profile with required soak and dwell periods, the zone lengths do not matter. For lead free, usually ramp to peak is preffered.that is with minimum soak (you can not avoid soak anyway. You can achieve the profiles irr
Electronics Forum | Sun Sep 28 17:14:53 EDT 2008 | ronsou
small pads like 0402 tend to get hot quite > easily. looks like excessive heat is your problem > here. pads are wetted, component leads are not. > this means solder paste flux on top layer was > exhausted before entering in reflow. your profile
Electronics Forum | Mon Jun 07 17:28:07 EDT 2004 | edatasys
LSP is 'Long Soak Profile'. See http://www.aimsolder.com/tds/NC_297DX_Sn62_&_Sn63_Solder_Paste.pdf Looks like a variation of the RSS, with you guessed it a longer soak.
Electronics Forum | Tue Sep 20 11:41:17 EDT 2005 | davef
We don't know how to accelerate soak recipes. We'd suggest that you use the recipe for your product use environment that is suggested in SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments
