Electronics Forum: soft limit over (Page 8 of 35)

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef

5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke

Popcorn effect with PBGA

Electronics Forum | Tue Apr 04 12:41:20 EDT 2000 | emmanuel

In some technical reports, i have recently read that when processing a PBGA, it is worth controlling the reflow temperature under 205�C. Indeed, over 205�C some people have noticed plenty of popcorn effects. Is this point really true ? Does this te

Re: Step-down stencil Versus Reduced Aperture Design

Electronics Forum | Thu Sep 02 08:06:01 EDT 1999 | Wolfgang Busko

| | I'd like to know the advantages and disadvantages between the two. | | | | Thanks and regards, | | However, I really like aperture reduction best after running the experiment while using .006" thick foils as the practical limit. This really w

qfp reflow problems

Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron

Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m

About testability of OSP board

Electronics Forum | Sun May 02 16:57:09 EDT 2004 | davef

You're correct. We prefer to probe solder, rather than copper, because the solder absorbs the impact of the probe better than copper and so, helps preserve the life of the probe. Beyond that, OSP has a limited "shelf life". If the OSP is not coate

If we could bake the Board with OSP finish?

Electronics Forum | Fri Aug 06 10:07:50 EDT 2004 | blnorman

OSP has limited elevated temperature exposure capability. Couple that with the fact that solvents (IPA in particular) will remove the OSP. The more material you loose the higher the chances for pad oxidation. We ran an experiment with board washin

Machine Optimization Software

Electronics Forum | Thu Aug 19 16:50:39 EDT 2004 | davef

The best way to reduce change-over time is to: * Buy lots of feeders * Limit the number of part numbers available to design engineers * Bar code feeders to help verify proper machine setup We know of no such software. There IS software that recomme

I have several memory devices that have 2% bismuth in the lead c

Electronics Forum | Tue Feb 08 15:05:22 EST 2005 | Keith Lengling

I have several memory devices that have 2% bismuth in the lead coating. Is this enough bismuth to be concerned over the formation of a low temperature SnPbBi alloy? What are the allowable limits for bismuth in an SnPb process for both SMT and through

Comet Philips machine error

Electronics Forum | Wed Nov 16 09:33:39 EST 2005 | SuMoTe

I can't help you with most of that, but heres a starting point. "L013: 2nd limit over" means that one of your axis is showing outside operating boundries, as in placement head is too far forward. Make sure all your devices are not pushed out to thie

Quad IVc Main Breaker

Electronics Forum | Tue May 07 16:02:09 EDT 2013 | ngineer

That's good info for making sure the motor is good before plugging in and possibly over-current another stepper drive. Do you happen to have pin-outs for the DB15 on the drive board, pot settings and current limit of this drive? We keep several ste


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