Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani
Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f
Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske
Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi
Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny
Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov
Electronics Forum | Mon Aug 16 20:22:54 EDT 2004 | Grant
Hi, Thanks for the info! In the software can you add solder paste specs and heat sensitive components and see where the profile sits against these fast? Measurement is the easiest part I think, but what I thinks harder is good software to analyze th
Electronics Forum | Thu Mar 16 19:12:22 EDT 2017 | pzappella
Hi Rob, Thanks for the LED paper. I like the void area equations but I am puzzled, the paper did not say if the solder was a solder paste that would generate a lot of voids, or a fluxless preform or sinter material. The measured voiding level
Electronics Forum | Fri Aug 08 11:37:09 EDT 2008 | pjc
Yes, sure. In fact in some applications ICT is coming back. Mainly due to the fact that more and more SMT discrete components have no markings, so AOI cannot tell you if you have the correct value on the PCB. Fixed pin or flying probe ICT is a valuab
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
Electronics Forum | Wed Feb 15 19:20:46 EST 2006 | Mr. Samir
Russ, On both instruments, I ran them through the wave 20 times each using identical profiles and wave parameters, and then used statistical formulas to measure the variation and repeatability of each. I had these all in Excel, but that was around 1
Electronics Forum | Wed Feb 15 08:47:09 EST 2006 | pjc
Yes, doing the DoEs on your wave to achieve optimum settings that deliver the best results on your worst board is correct method. If not clear on the process, there are still wave solder process classes out there you can attend or hire in-house. If y
Electronics Forum | Wed Feb 15 13:44:34 EST 2006 | samir
Bingo! In my career, I've used Wave Solder optimizer and the WaveRIDER. Pro's and Con's to both. I did a GR&R on both as well, and WaveRIDER came out on top. The main challenge is to get the operators to use it. I've found that the operators wer
