Electronics Forum | Thu May 01 12:28:56 EDT 2008 | petergog
what is the main concern about this reqirement? Why IPC-A-610c is revsised to this? IPC-A-610c said it is a defect.Solder touches the body of a plastic bodied component, eg SOICs and SOTs. But D version think it is acceptable. WHY? I thought "plasti
Electronics Forum | Wed May 03 15:45:44 EDT 2006 | Tim
Brett, I've found out that it is not a defect with respect to Rev. D. You are correct about the thermal expansion but due to the size of the plastic SOIC's and SOT's they have eliminated it as a defect. Thanks, Tim
Electronics Forum | Wed Oct 21 16:23:11 EDT 1998 | Jeffrey Long
My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I di
Electronics Forum | Wed Dec 05 13:19:23 EST 2012 | markcsi
We have an SMT-5000 that we have been using for many years, but up till now the smallest device was SOIC, SOT23 type devices. Now I have designed a board that has a 24 pin TQFN-EP device and a 10 pin LFCSP_W device. I am concerned that this is be
Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis
After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble
Electronics Forum | Wed Jul 22 19:15:56 EDT 2015 | Mike
Does anyone know if theres a way to program a SOT23 or SOIC-8 with a pick and place machine on the fly? I have a pair of Mydatas if anyone know if they have the option
Electronics Forum | Thu Oct 22 14:39:22 EDT 1998 | Chrys
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
Electronics Forum | Sun Mar 21 06:27:45 EST 1999 | Bob Willis
| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto
Electronics Forum | Thu Oct 22 01:43:43 EDT 1998 | Frank J. de Klein
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
Electronics Forum | Fri Oct 23 04:16:16 EDT 1998 | Tony B
| | My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When
