Electronics Forum | Thu Dec 28 20:56:08 EST 2000 | Dave F
This is not a real demanding job. We've talked about materials sources before, check the fine SMTnet Archives. Responding to your question, try: Circuit Repair Rowley,MA 508-948-7973 [Jeff Ferry is a contributor to SMTnet, so ya gotta go there fir
Electronics Forum | Fri Dec 15 13:57:46 EST 2000 | genny
It is only after the reflow heating process that the peaks may show up, as the solder build up in some vias(due to HASL'ing) might drip down during reflow. I don't think I've ever heard of it being desirable to have a bare copper surface that will ox
Electronics Forum | Wed Dec 13 11:15:20 EST 2000 | Travis Slaughter
I�m not sure but it looks like the �mini-chip thingie� is a filter cap if so it should not stop the playstation from working, may not work like you like but should do something. Did you use any static protection? If not you may have fried one or all
Electronics Forum | Fri Dec 15 08:00:57 EST 2000 | Pete B
John, We regularly wave solder electroless silver finished boards (Alpha Level)with mixed SMD and through hole parts and do not have any problems. We have changed a number on PCB's from HASL to electroless silver, mainly for the benefits at SMD whe
Electronics Forum | Fri Dec 08 11:08:03 EST 2000 | Antonio
Ok fellas, tell me how you'd fix this! I'm having melf connectors that are tombstoning in the wave, NOT the reflow, the wave. I've never seen this before. All other parameters are the same...solder, preheats, placements, the board, building humidi
Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M
Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa
Electronics Forum | Thu Nov 30 13:51:33 EST 2000 | Michael Parker
Thanks for the details. Next question- where is your first time pass rate measured? Is this at test? Do you have inspection gates at the end of each process step? To get to the root cause, you need the earliest detection. Collect attribute data by a
Electronics Forum | Tue Nov 07 09:26:37 EST 2000 | Peter Barton
Adam, The most common cause for this problem is a variation in the plating thickness of the through holes, particularly if they are Sn/Pb solder levelled PCB's. Most pressfit connectors require a fairly tight control on the diameter of the holes to
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Thu Oct 26 04:05:09 EDT 2000 | JohnW
George, where exactly is the diagreement ?, is it on the point if you should be doing the SPC on the paste or is it how the data is being interpreted ? The problem with SPC is every quality bod has another idea as to how it should be looked at, Xba
