Electronics Forum | Wed Jul 27 01:34:17 EDT 2011 | JOSEPH PJ
hey am working in continuos improvement dept and am lokking foraward to save time and cost by imlimenting solder paste catridges in place of jars can any one help me out in this topic! with regards JOSEPH
Electronics Forum | Mon Aug 04 15:26:20 EDT 2014 | cyber_wolf
Whether or not SnPbAg will cause issues is trivial. You must build to the solder specified on the print.
Electronics Forum | Fri Jun 12 07:14:36 EDT 2015 | gabinocf
Thanks by your response, at this moment I have problems in a Lead Free process the issues that i have are solder peaks, by my understanding this conditions is due to lack of flux, bad temperature profile or the dwell time is too long. My concern is,
Electronics Forum | Wed Jan 11 09:21:19 EST 2017 | rgduval
Do you have some pictures of the condition that you are facing? Your description of the issue sounds more like dewetting, rather than cold solder. A picture would help us better understand what you're facing. Cheers, ..rob
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Tue Dec 31 09:24:22 EST 2019 | SMTA-Davandran
You may try reduction on stencil aperture on the particular IC location. Reduction on width and extend outer length may help to minimise solder ball issue. However, please look into stencil foil thickness to meet AR.
Electronics Forum | Fri Jan 03 11:37:24 EST 2020 | emeto
Sometimes might be internal change with personnel. Issue is actually there, but if no one questions it-it is not an issue. With 7mil stencil there is a good chance to have solder balls. So were they registered or were they fixed/cleaned?
Electronics Forum | Sat Feb 06 07:14:40 EST 2021 | agoesfirmanto
Dear Sirs, very sorry being late reply after a year. Thank you very much for your advices, you are absolutely correct after reduce grounding pad size. No more solder ball issue. Thank you very much. highly appreciate all of your supports. Best re
Electronics Forum | Sat Feb 06 07:17:47 EST 2021 | agoesfirmanto
Hello Pak Zack. very sorry late reply Thank you for your sharing. Solder ball issue already solved. Best regards, Agoes
Electronics Forum | Fri Mar 17 12:00:52 EDT 2023 | previnmoore
Its the kiss 103 selective solder machine. The end of the travel, it's the x axis. when i tried jogging it nothing happens just makes a noise. Thanks for responding.
