Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory
Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun
Electronics Forum | Thu Sep 17 01:44:42 EDT 1998 | Robert Murphy
| Gentlemen, | Can anyone provide information on selective soldering systems that compete with Ersa's VersaFlow? Does anyone have experience with this machine or other machines of this nature? | My company is considering acquiring to increase techn
Electronics Forum | Tue Sep 15 08:49:09 EDT 1998 | Chrys
| Gentlemen, | Can anyone provide information on selective soldering systems that compete with Ersa's VersaFlow? Does anyone have experience with this machine or other machines of this nature? | My company is considering acquiring to increase techn
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Jul 13 06:44:06 EDT 1998 | wayne
Bob: It was just a thoguht. Wayne
Electronics Forum | Fri Jul 10 13:55:16 EDT 1998 | Bob Willis
After reflow the paste on a copper pad should spread out from its original print dimensions it should ideally not prior to reflow as that is a hot slump. The better the solderability of the OSP or the higher the activity of the flux will greter flow
Electronics Forum | Fri Jul 10 14:40:12 EDT 1998 | Bob Willis
Yes this can be a killer. Its caused by glues with a high water content or fast curing of glues. When you get solder going through the glue it is litterally sucked in during solder wave contact. If you have never seen it you would never believe it bu
Electronics Forum | Fri Jun 19 18:44:23 EDT 1998 | Steve
Does anyone have wave solder experience using OSP and VOC free no clean flux?
Electronics Forum | Mon Jun 08 14:52:46 EDT 1998 | Mike
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
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