Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon
| | How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can
Electronics Forum | Wed Jun 03 21:51:33 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData
We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75
Electronics Forum | Sat Apr 04 17:11:29 EST 1998 | Steve Gregory
| Can anyone help with advice on the possibility | of "rejuvinating" aged solder paste | for SMT applications. | Thanks! Peter, I wouldn't even try...even if you had all the different chemicals that you needed to do it properly, the formula's f
Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders
Yes, norm it is. Look back to February 98 discussion on this issue.
Electronics Forum | Tue Mar 24 09:26:56 EST 1998 | Jim Kittel
Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via?
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Mon Feb 23 16:59:43 EST 1998 | Doug Romm
Dave, "Paladium Pillows and Bad Dreams"....that's a good one! I've been doing this for the last 9 years and I've heard quite a bit, but that's really cute! Seriously, in reference to the 'pillow effect' when the lead looks like it is "sitting" on to
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
