Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData
We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75
Electronics Forum | Sat Apr 04 17:11:29 EST 1998 | Steve Gregory
| Can anyone help with advice on the possibility | of "rejuvinating" aged solder paste | for SMT applications. | Thanks! Peter, I wouldn't even try...even if you had all the different chemicals that you needed to do it properly, the formula's f
Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders
Yes, norm it is. Look back to February 98 discussion on this issue.
Electronics Forum | Tue Mar 24 09:26:56 EST 1998 | Jim Kittel
Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via?
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Mon Feb 23 16:59:43 EST 1998 | Doug Romm
Dave, "Paladium Pillows and Bad Dreams"....that's a good one! I've been doing this for the last 9 years and I've heard quite a bit, but that's really cute! Seriously, in reference to the 'pillow effect' when the lead looks like it is "sitting" on to
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Mon Dec 08 14:40:08 EST 1997 | Rin Or
| First Responses Lost: Please Repost | | Looking for info on process flow for 2 sided SMT with PTH | | on the top side. | | Both sides have large SMT ICs. I don't know what the best approach is; | | Epoxy, Paste in Hole, High temp paste. | | Any in
Electronics Forum | Thu Aug 23 11:07:58 EDT 2001 | Hussman
Yup - this is what the homeplate design does.
