Electronics Forum | Tue Mar 12 20:44:13 EST 2002 | davef
The fine SMTnet Library has several "terms & definitions" documents that may be helpful.
Electronics Forum | Tue Mar 19 15:38:48 EST 2002 | stefwitt
For a few thousend boards, I would look into some automation. In order to get the components off the boards you could run the boards through the reflow oven with the cooling fans turned off. When the boards come out of the oven the solder is still l
Electronics Forum | Fri Apr 05 17:40:22 EST 2002 | davef
I too would be amazed if Chris is wave soldering this socket and component. It's possible that these devices are on the primary side.
Electronics Forum | Mon Apr 08 07:02:03 EDT 2002 | PeteC
Don't know that mfg. and model but theres lots of info on vapor phase soldering in the fine SMTnet archieves.
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Tue Apr 09 08:27:55 EDT 2002 | davef
Read SM-785 - "Guidelines For Accelerated Reliability Testing Of SM Solder Attachments"
Electronics Forum | Tue Apr 16 06:29:16 EDT 2002 | Matt Kehoe
Have you considered Solid Solder Deposition? www.sipad.net mk
Electronics Forum | Sun May 19 10:45:33 EDT 2002 | ab
From your stencil, if not clean, you can have residues, try increasing the frequency or using solvent with the wipe.
Electronics Forum | Mon Apr 22 23:51:06 EDT 2002 | mkkrishnakumar
Dear sir, I am a regular viewer of smtnet.com and now one of my customer have the process problem that is they are having double sided smd's and pth too. hence we have suggested them to do the following processes First do the smd soldering by ste
Electronics Forum | Wed Apr 24 21:34:01 EDT 2002 | davef
Search the fine SMTnet Archives. Guidelines * Control: Flux specific gravity, preheater temp, conveyer speed, solder temperature. * Two most important parameters are: solder temperature & dwell time * Contact time. The optimum contact (dwell) time