Electronics Forum | Wed Nov 06 12:11:29 EST 2002 | russ
On this I was thimking of cartridges and not syringes.
Electronics Forum | Fri Nov 08 14:51:37 EST 2002 | davef
You should take steps to prevent paste seperation, regardless of the container type.
Electronics Forum | Tue Nov 05 22:57:50 EST 2002 | davef
Grainy solder is a process indicator. It is not necessarily a defect. Search fine SMTnet Archives for background.
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Mon Nov 11 09:39:02 EST 2002 | dphilbrick
Cool! What will they think of next! Maybe solder with no lead or parts with thousands of connections you cant see!
Electronics Forum | Tue Nov 19 13:15:33 EST 2002 | Mick
Why not use preforms preladen with flux to save the guess work - contact Alpha Materials. Regards
Electronics Forum | Wed Dec 18 11:38:53 EST 2002 | johnw
Soup mix works well for this as well.......
Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto
what exactly do you mean by big thermal pad?
Electronics Forum | Wed Feb 19 19:24:12 EST 2003 | arturoflores
Is there any way I can attach a report?
Electronics Forum | Mon Jan 13 16:23:29 EST 2003 | Eric Brown
Does anyone know of documentation that specifies whether or not voids in BGA solder joints hurt or help performance?
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