Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
Electronics Forum | Fri May 30 11:24:45 EDT 2003 | dsuraski
We also use microns to describe solder paste powder particle sizes.
Electronics Forum | Fri Apr 25 14:56:40 EDT 2003 | razor
Please explain the phenomenon of solder leaching on SMD end caps. What is the root cause? What is the best control method?
Electronics Forum | Wed Apr 30 21:18:55 EDT 2003 | davef
Morris Why do want to do this [keep solder from pads]?
Electronics Forum | Thu May 01 09:19:59 EDT 2003 | davef
ehess Why do YOU want to block apertures to keep solder from pads?
Electronics Forum | Tue May 06 15:09:33 EDT 2003 | russ
Is that coating pliable? How is it cured? Russ
Electronics Forum | Fri May 02 08:26:36 EDT 2003 | davef
Bill Why do you want to do this analysis? There are limited IMC that can form.
Electronics Forum | Thu May 22 12:08:36 EDT 2003 | Kris
What solder are you using ? what is the peak temeprature ? Are you using the right tools to place these components ?
Electronics Forum | Thu May 29 13:37:36 EDT 2003 | russ
IPC-SM-782 and IPC-CM-770 have somw pretty good info. Russ
Electronics Forum | Fri Jun 13 09:37:33 EDT 2003 | davef
What does your current paste supplier suggest?
.gif)
.png)
