Electronics Forum | Mon Jul 01 08:33:55 EDT 2013 | markhoch
A couple things to look at.. Are you using Pb-Free solder? What are the leads of the SD Connector tinned with? Do you have a thermal profiler to use to verify your oven profile? (If not, you may be able to ask a Sales Rep to come in and assist y
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
Electronics Forum | Mon Jul 08 13:19:06 EDT 2013 | williamaxler
There are a lot of things that you need to look at to figure this out. What type of flux are you using? Is this leaded or lead free? Do you have the gradient of the nozzle setup properly? Are these locations tied to plains? With that being said
Electronics Forum | Fri Jul 26 12:55:46 EDT 2013 | gallionc
I agree with both previous statements. You may have already sorted this one out, but regardless of whether you are running leaded or lead free, the first things I would look at is sufficient flux and sufficient heat/dwell time. It sounds like you a
Electronics Forum | Wed Jul 17 10:44:19 EDT 2013 | gregcr
Hi All, Has anyone seen or used equipment that is capable of automating the process of attaching hookup wire directly to a large SMT pad? Soldering, ultrasonic? I'm looking to see if there is a machine that is capable of automatically taking a tef
Electronics Forum | Wed Sep 04 07:15:02 EDT 2013 | anilw2006
We have using SAC305 type solder paste for lead free process. One sample paste received of SN100C.After reflow SN100C type paste joint looks brighter and good compare to SAC305. Please help me which paste is good for smt process?
Electronics Forum | Sun Sep 08 18:06:30 EDT 2013 | davef
Protect the board: If solder mask protects the board, the level of protection is limited and inconsistent. If you want protection, you need the be thinking conformal coating. Selective ENIG: I believe the reason solderability protection, except mayb
Electronics Forum | Thu Sep 26 23:14:25 EDT 2013 | zsoden
We picked up this old (circa late 80s) Seho 1135 machine last year for next to nothing. It needed a bit of TLC to bring it back to working order but it's 99% working now. The only problem left is that we cannot get sufficient height from the delta wa
Electronics Forum | Fri Dec 20 06:12:17 EST 2013 | bandjwet
Jimmy: Make sure to look in and around the board to make sure you have captured all locations of solder balls/fines as they are commonly caused by the profile or print issues. If they are non-embedded and are a 610 defect based on the class of your
Electronics Forum | Wed Jan 22 10:24:23 EST 2014 | cyber_wolf
No matter how good your process is, you will get solder on the gold fingers/lands unless they are protected. We have proven that solder will get on the gold fingers in the reflow oven. How that happens....we arent't 100% sure...there are a lot of the
