Electronics Forum | Fri Mar 03 13:39:39 EST 2017 | proy
Just about to set up a lead free solder pot exchange system for my Electrovert. Wondering if anyone has had success using say large ball bearings or materials which will sit inertly in the bottom to occupy space and reduce the alloy required without
Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm
Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.
Electronics Forum | Tue Jun 06 15:42:36 EDT 2017 | stratsmyboy
Hi im new to the forum. We have product where we have applied a carbon finish. I want to remove the carbon to reapply but cant seem to find a solution. Its baked onto solder mask. Any ideas? I was hoping something non abrasive to save scratching the
Electronics Forum | Thu Jun 08 09:43:42 EDT 2017 | davef
You know the scary part about your mentioning a tread where I post something? Well. let's just say that 2007 was a long time ago. Anyhow, silver will dissolve into your solder and provide no barrier. Some people apply a silver flash plating over the
Electronics Forum | Mon Aug 07 13:27:40 EDT 2017 | dleeper
Are you seeing this on bare PCBs or after assembly? with Immersion silver, the finish over the copper should be very thin and uniform, that's the main advantage of ImAg. You should not be seeing excess plating filling vias unless: A)Its HASL, not
Electronics Forum | Fri Aug 18 03:46:29 EDT 2017 | stivais
The first reply from Tsvetan Usunov already answered your question - there are no thermals for one side of the chips. You can try to reduce the phenomenon by using different solder pastes, tuning your soldering profile or even switching to different
Electronics Forum | Thu May 17 03:23:44 EDT 2018 | shuhaib
the D-PACK IC are falling down in primary side while second side reflow soldering. the solder paste volume is ok. reflow time ( TAL ) is less than primary side. but still issue is happening. let me konw how to prove it is DFM issue, because its hea
Electronics Forum | Sat Dec 16 06:16:14 EST 2017 | sherman
In order to find applicable fume extraction, actually it depends on your application. we would like to ask you to check out: http://widaco.net/ to fine out products that we can provide. Fume extraction units that we provide fall into 2 groups: solde
Electronics Forum | Thu Jul 25 18:41:52 EDT 2019 | myke03o
Hi I have solved the issue. The component cracking are the big 1210, 0603 and 0402 capacitors. After studying and testing in many type of solder. The best to use is SnPb and the components are the key - there are component which will tend to expand
Electronics Forum | Thu Sep 05 10:15:58 EDT 2019 | SMTA-Richard
There are multiple solder alloy options and we have tested many of them in a consortium project. There also are very specific challenges associated with testing using the -40/150 C profile. This is way too complicated to discuss in a chat room. Se
