Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue
Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.
Electronics Forum | Mon Sep 10 16:55:29 EDT 2018 | wrander1
Hi, I am looking for a Solder jet supplier. Micronic does not support my small dot size LEADED solder paste. I can not use stencil print because my substrate is fragile. I need a run rate of 10,000 dots per hour and 99.99 % dots +- 10% volume. Equip
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Wed Oct 10 12:16:10 EDT 2018 | dleeper
davef The rest of your list looks good, but I'm not buying: "* Squeegee is heavily magnetized" Magnetic susceptibility of typical solder alloys isn't very high so even if your squeegee was heavily magnetized I wouldn't think it would effect the pa
Electronics Forum | Wed Oct 24 07:28:36 EDT 2018 | tech1
It will in a limited fashion. It is a scanner and when using it for solder or lead inspection you will probably get many false calls, Operators tend to fall asleep clicking "accept" all the time. Don't get me wrong, we run one of these systems and it
Electronics Forum | Sat Feb 16 20:13:45 EST 2019 | sarason
Your silver immersion layer is dissolving in the solder. I presume this is what is meant to happen. But with copper tracks underneath that should be fine. Does your SAC305 cover all of the pad. If so no problem. If not then you will need to flux your
Electronics Forum | Wed Mar 27 07:01:26 EDT 2019 | charliedci
200uM seems high. I say this because typically our solder stencils in this application are between 80uM and 100uM thick which would leave the component height less than that after reflow. However if your not experiencing any shorting between pads I w
Electronics Forum | Fri Apr 12 07:40:50 EDT 2019 | krob
We have found that our wave solder will produce worse hole fill/top side fillets nearest the conveyor, on most boards. I believe this is due in part to the smaller contact patches near the conveyor fingers. What could cause this reduced contact
Electronics Forum | Fri Jun 07 04:57:53 EDT 2019 | gregoryyork
Its more than likely the conveyor is slightly out and needs dropping. You do have a fairly significant contact though so are you sure the Solder pot isnt running too cool for Lead free, needs to be around 275C for good wicking and flow or 250C if lea
Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
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