Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Wed Jun 20 15:09:33 EDT 2007 | realchunks
Hi D, 99% of the time we get brokered parts, the big problem is co-planerity. Havn't seen a solderablity issue yet, but.... For solderability I guess it would depend on the part. 30 pieces is the general rule for SPC, so maybe start there? We ge
Electronics Forum | Mon Jun 10 13:31:29 EDT 2013 | emeto
Is there anything on the other side of the board? If not the process will be very standard. 1. SMT - place the small parts on your board. It is called surface mount technology. Basically one machine applies solder paste on the board, another machine
Electronics Forum | Mon Jun 14 16:48:34 EDT 2004 | jsmith01
Is any one else having a problem with parts that are Ni/Sn plated? The parts in question are a 1206 voltage suppressor form AVX. I am still using a stander 63/37 solder paste which is according to AVX�s web sight compatible with this plating. The
Electronics Forum | Fri Nov 30 14:38:42 EST 2007 | ratsalad
One of our former SMT Technicians used a component we pick and place for this purpose. The component is a bond pad that is soldered to a ceramic PCB during SMT assembly. The assembly is now obsolete. I tried looking up the manufacturer's part nu
Electronics Forum | Wed May 16 10:37:58 EDT 2007 | wavemasterlarry
what in blue blazzes is going on here? i here what youre saying but cant pick up what youre lying down! Why in gods gravey would you wantto solder on a static mat? You can degrade the mat if your solder burn threw it. I asked our all noing macani
Electronics Forum | Thu Jun 17 21:31:06 EDT 1999 | Dave F
| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w
Electronics Forum | Fri Aug 24 12:24:35 EDT 2018 | davef
Could be ... Consider this: The LED and the BIG pad reflowed before the small pad. The superior force of the solder on the BIG pad pulled the LED over and the LED took the solder on the little pad along with it. Try this: Print paste on a board. No
Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework
I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free
Electronics Forum | Wed Mar 01 09:34:13 EST 2000 | Sorin
HELLO, Do anybody know if is existing an empirical rule that can show me how many amps can carry a plated through hole with a diameter of x.xx millimeters? Is there a formula depending on X.XX value that could help me to make such calculations? How
