Electronics Forum: solder a (Page 515 of 1484)

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Mon Apr 13 07:55:48 EDT 1998 | justin medernach

Dear Justin, I am not asking for experiences with ovens as to whether you think they are capable of THT reflow. I am asking more specifically about actual req's and experiences with THT reflow, regardless of the oven used. Your answer does not hold i

Re: Solder paste SPC analysis

Electronics Forum | Wed Oct 25 17:26:38 EDT 2000 | Dave F

George: Crucifixions!!! YES!!! I love crucifixions!!!! [Well I do, providing I�m not the crucifixee that is ] The pomp, ceremony, wailing, grumbling, and brat on the grill. You�ll find little sympathy here. Phil and Wolfgang make good points.

Air Vac Mini Wave Process

Electronics Forum | Mon Jan 27 14:16:46 EST 2003 | russ

i have done this thousands of times. You are correct about no preheat, however it never seemed to be any issue for us. You do have to make sure that you do not expose any SMT comps. to the solder or they will become heat stressed/fractured. Connec

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef

ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in

New Facility Advise/Questions

Electronics Forum | Mon Jan 06 12:21:21 EST 2020 | rgduval

We wanted to filter the exhaust from the oven and selective solder...so, the ducting from the machines went into a common plenum that contained both a particulate filter, and a HEPA filter. That plenum exhaust was connected to a roof fan that vented

Re: Solder Shorts Under SMT Resistors/Capacitors

Electronics Forum | Wed Sep 22 22:32:40 EDT 1999 | Dave F

| We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the bo

Replacing small SMD PMICs

Electronics Forum | Sun Feb 10 20:27:50 EST 2008 | jmelson

As long as it doesn't have a thermal pad soldered under the package, it shouldn't be a big problem. Small, pointed iron, stereo zoom microscope if you can find one, or a head-mounted magnifier. Lots of light. Rest the heel of your hand on the boar

Lead free rework of BGA

Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff

Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo

Re: Nonrecurring Cost

Electronics Forum | Wed Sep 20 09:02:24 EDT 2000 | Erick Russell

The programming is simple and is based on just a few simple parameters. There is no CAD interface required to program the equipment. You must key in the dimensions of the component (X-Y and Thickness) and then specify the required thermal process.

BGA Pad Cratering

Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289

This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i


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