Electronics Forum: solder a (Page 517 of 1482)

Solder paste change

Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim

Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha

PIP plus

Electronics Forum | Mon May 08 22:39:18 EDT 2006 | smartasp

I have read an interesting article on pip plus, where they say "However, both PIP processing and the use of solder preforms are well-proven methods. The combination of pin-in-paste plus solder preforms delivers numerous benefits compared to a combi

COB pad contamination from kapton tape adhesive

Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef

Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc

SMT COMPONENTS TESTING

Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef

MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett

Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:05:59 EST 2000 | Istv�n Dominik

I received data sheets from a paste distributor in which Amtech gives a recipe how you can mix solder cream. They deliver the flux in plastic jars and the solderpowder in foil packages. You must mix the two components with a simple mixing tool. Has a

Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:05:59 EST 2000 | Istv�n Dominik

I received data sheets from a paste distributor in which Amtech gives a recipe how you can mix solder cream. They deliver the flux in plastic jars and the solderpowder in foil packages. You must mix the two components with a simple mixing tool. Has a

Re: non-wetting on gold land pad

Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F

Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in

SRS

Electronics Forum | Wed Jan 07 19:31:02 EST 2004 | kenBliss

Bliss Industries has been offering a complete system for years. Our Solder Recovery system allows the operator to remove dross and solder safely, service the pump and contain all the fumes. The solids ends up in a drum ready for recycling. The dus

problem in solderability

Electronics Forum | Wed Sep 03 17:09:23 EDT 2008 | glennster

Omid, In some cases we have been able to restore acceptable solderability by dipping the leads (one side at a time) in an active flux and then re-tinning. Usually a good visual inspection after tinning would reveal whether this was going to work.

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul

I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to


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