Electronics Forum | Wed Sep 03 17:09:23 EDT 2008 | glennster
Omid, In some cases we have been able to restore acceptable solderability by dipping the leads (one side at a time) in an active flux and then re-tinning. Usually a good visual inspection after tinning would reveal whether this was going to work.
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Mon Sep 26 12:58:33 EDT 2011 | action_101
So you are saying that building to class III is going to prevent failures? I disagree. Class III is trying to hit target condition in every aspect of the production of the circuit board. That my friend does not ensure failures from happening. I see
Electronics Forum | Wed Sep 09 13:12:34 EDT 1998 | Dave F
| Hi, | I work at a service department in Portugal and we are recently ISO9002 compliant. After our 2 billion audits, they asked us to improve our soldering documentation by joining information on soldering and desoldering regular and SMD IC's, like:
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Tue Aug 24 04:35:33 EDT 2004 | rlackey
Hi Mike, Thanks for the comments. We are upgrading our post reflow inspection - primarily solder joint inspection, and capable of keeping up with a maximum of 80K components an hour. Solder paste inspection is currently carried out by our prin
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
