Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Tue Aug 24 04:35:33 EDT 2004 | rlackey
Hi Mike, Thanks for the comments. We are upgrading our post reflow inspection - primarily solder joint inspection, and capable of keeping up with a maximum of 80K components an hour. Solder paste inspection is currently carried out by our prin
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Mon Oct 23 21:01:18 EDT 2000 | Dave F
Don't overlook the SMTnet Archives there is quite a bit of experience there from people slopping solder on their gold fingers.
Electronics Forum | Thu Jul 20 16:02:46 EDT 2000 | newf
Will component manufactuers need to look at possible new coatings for pins when to be used in a PB- free enviroment? PT 2 Will new solder joint inspection criteria have to be developed for the use of lead free solder?
Electronics Forum | Fri Aug 20 15:33:02 EDT 1999 | Mark
Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! TX Mark
Electronics Forum | Mon Oct 05 03:17:32 EDT 1998 | Christoph Prem
Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has?
Electronics Forum | Fri Jun 25 12:10:34 EDT 2004 | tcp
We use water soluble paste, Kester R560. These units are wave soldered and cleaned in an Electrovert Aquastorm water wash with a 3% Kester saponifier solution in the first stage.
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