Electronics Forum | Tue Jul 03 11:56:13 EDT 2001 | Russ Roberts
I am a Manufacturing Engineer working on a new bid. Please help with my question about a new process that I am unfamiliar with: The Assy that we are quoting involves a SMT PCA that is soldered to an aluminum chassis. All surfaces of the chassis that
Electronics Forum | Tue Sep 06 12:39:06 EDT 2011 | deanm
According to IPC-7351A, the optimum fiducial is a solid circle with a minimum of 1mm diameter, but can be up to 3mm. There should be a solder mask clearance a minimum of 2x the radius of the copper circle. So the minimum fiducial size is 0.040" with
Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Fri Dec 15 15:59:35 EST 2000 | Hussman
Dave, It will all be about the same - changing atmospheres does not affect your heater output. You may experience some differences in the way your solder joints look (a little duller), but with some of the newer pastes out there, you can overcome i
Electronics Forum | Fri Apr 10 14:10:13 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
Electronics Forum | Fri Apr 10 14:08:51 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
Electronics Forum | Tue Sep 18 10:22:22 EDT 2001 | jschake
Paste Flux / Reflow: Our experiments indicated that the combination of no-clean solder paste and air forced convection reflow produced the fewest tombstone defects, followed by water-soluble paste reflowed in air, and most tombstones occurring with
Electronics Forum | Thu May 19 13:03:18 EDT 2005 | russ
On the non-wetted holes put a solder iron to them and see if they "bubble" if so, you have some outgassing in your PCB and they will need to be baked prior to assembly. If this is okay I would investigate the grnd layer that was mentioned. What is
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.
Electronics Forum | Tue Feb 03 03:35:30 EST 2009 | sachu_70
Hi Jose, such a process is possible, but you need to confirm that the PCB material has high Tg. In additon, you need to re-look solder paste printing parameters and make required changes in stencil apperture design for optimum solder volume. Just a
