Electronics Forum: solder a (Page 531 of 1483)

Solder Paste not dry after Wave

Electronics Forum | Wed Feb 23 01:06:06 EST 2011 | kemasta

Hi all Recentlt I encounter a issue, the solder paste was not dry after wave. Mostly happen and the end of the board. It is rare case, 1 day happen about twice. But to achieve our quality target, I still need to overcome this issue. I use Alpha OM-

Stacking/piggyback chip.

Electronics Forum | Mon May 23 09:28:26 EDT 2011 | alcatel

I need to stack 2 resistors size 2010 on one location. Ive heard that there is a chip like solder solid which could be placed on the solder pad connecting both chips with its height, but never got much detail about this. cant afford to be doing thi

Selective Solder machines

Electronics Forum | Thu Nov 01 12:58:40 EDT 2012 | bburn

My company is looking to purchase a new selective solder system. We're currently looking at the ACE KISS 205 and the ERSA Versaflow3. I am hoping to get some feedback from anyone who has worked with either of these machines or the companies themsel

Solder paste label

Electronics Forum | Fri Apr 26 15:01:09 EDT 2013 | jorge_quijano

Hola Evtimov, I do the same with my Solder Paste Jars, there is a label that is filled by the warehouse guy & by the line operator; time & date the jar arrived to plant, time & date the jar was taken to production line (out of the refrigerator) and t

Solder Ball

Electronics Forum | Tue May 14 21:59:25 EDT 2013 | davef

SAC is a lead free solder alloy. At one time, Nippon Micrometal Corp. (NMC) [158-1, Sayamagahara, Iruma, 358-0032, Japan; +81.4.2934.6101 F+81.4.2934.5454 nmc-net.co.jp] called some of its alloys: LF35, LF45(SAC305), LF38(SAC105) and LF31(SAC405).

Type 3 Solder Print/Squeegee Speed

Electronics Forum | Fri Feb 28 15:27:50 EST 2014 | tombstonesmt

Good afternoon! Looking to see what everyone else in the industry is running for print speeds regarding type 3 solder pastes. Our paste is a type 3 with 11.5% ROL0 flux content. The finest pitch component in our case is .5mm pitch. Our screen print

Solder Pot Volume Filler

Electronics Forum | Fri Mar 03 13:39:39 EST 2017 | proy

Just about to set up a lead free solder pot exchange system for my Electrovert. Wondering if anyone has had success using say large ball bearings or materials which will sit inertly in the bottom to occupy space and reduce the alloy required without

Surface Mount Connector Strength

Electronics Forum | Thu Jan 14 22:52:28 EST 1999 | Wayne

I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some const

Excess Flux in uBGA rework

Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt

Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r

Screen Printing Adhesive on Mixed Technology Boards

Electronics Forum | Thu Nov 15 07:59:53 EST 2001 | John S

My company is in the process of evaluating dispensing/screen printing vendors for a new production line that will build a mixed through hole and smt board in high volume. DEK recently came out with a system that uses a thick plastic stecil with mach


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