Electronics Forum | Thu Apr 06 15:35:04 EDT 2006 | jbrower
Larry, Are you a glutton for punishment, a masochist, just so sure that your answers are right and or important, or are you just REALLYYY bored at work and decided to be a dumb ass on the forums.. Loading boards into a flow solder machine for 12 ye
Electronics Forum | Wed Feb 26 17:05:42 EST 2003 | davef
Q1: Are the markings on resistors the actual value? A1: Generally, resistor marking indicates the value of the device, where the first two digits are the value and the third digit is the multiplier. Q2: Do AOI machines look for these markings or do
Electronics Forum | Wed Feb 09 13:07:01 EST 2000 | Jeff Woodruff
I have seen an issue that escapes our ICT and functional testing or operates in an intermitent fashion. The lead is slightly separated from the PCB with a fully formed solder joint behind it at the heel an toe. The joint apears to have started to tra
Electronics Forum | Mon Mar 07 22:23:40 EST 2005 | mrduckmann2000
Ken, You nailed it! We have a Electrovert Vectra wave solder machine that will erupt solder all over the place while heating up, we had to disable the timer because of all the solder splatering. Electrovert told us that our machine had a small des
Electronics Forum | Wed Mar 17 22:28:54 EST 1999 | Tony A
| After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voi
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Mon Aug 25 08:15:54 EDT 2014 | jax
With a melting point of roughly 300°C, you would need to have the product see temperatures peaking around 325°C at a minimum. (I would make sure the components and PCB materials can withstand these temperatures) Most convection ovens do not go over 3
Electronics Forum | Thu Jul 20 14:52:05 EDT 2000 | Bob Willis
If you are talking about Pin In Hole Reflow that is not true, I hope it was not my friends at Speedline that told you that. Stencil printing of paste for through hole reflow can be done. If you get all the parameters right it can give you joints lik
Electronics Forum | Wed Mar 13 10:20:51 EST 2002 | IAN T
WE HAVE A PROBLEM WITH SOLDER BALLING POST REFLOW WE ARE RELIABLY DISPENCING HERAEUS PASTE WITH A XY FLEX BUT WE'RE GETTING LARGE BALLS ON THE MELFS AND SMALL BALLS ON MOST CHIP PARTS WHAT SHOULD I BE LOOKING FOR? AND IS PAD DESIGN AN ISSUE (ROUND DO
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
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