Electronics Forum | Mon Apr 21 06:26:28 EDT 2003 | Grant
Hi, We have a SMT production like, however we have very little experience with through hole assembly. We design everything to be completly SMT based, however connectors are the only part of our product that still requires through hole assembly. Cur
Electronics Forum | Wed Aug 04 18:57:26 EDT 1999 | Dreamsniper
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | Hi Judy, In profiling you need an understanding of the reflow specs from the solder paste manufacturer then you nee
Electronics Forum | Wed Sep 05 07:07:25 EDT 2007 | mun4o
hi, I have a big problem with soldering uP QFP144 package.All components in PCB are small, only this chip is big and I can't make good temperature profile.Solder joints of other components are shining and with good wetting, but in QFP leads solder j
Electronics Forum | Fri Jun 24 04:51:38 EDT 2016 | unix60959
Hello, Does anyone know where I can find any information or documentation on the miniwave height sensor and control. I feel like the company I'm working for is possibly using the machine incorrectly in this regard. I assume, but would like to verify
Electronics Forum | Tue Oct 07 08:59:33 EDT 2003 | caldon
Will Philadelphia Work? My SMTA colleagues and I are putting together a Q/A. We will be having a panel discussion on Lead free on Oct 29. The panel is made up of industry leaders. Aim Solder- David Suraski, Cookson/Alpha/Electronic Assembly Materials
Electronics Forum | Thu Nov 05 13:38:43 EST 2009 | davef
Martin It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Thu Nov 30 22:47:54 EST 2000 | CAL
Contact Lee Whiteman @ ACI/empf. Lee is an industry expert in Leadfree soldering. He has also ran an IPC leadfree work shop involving a DOE on Leadfree Screen Printing. Lee can be reached at lwhiteman@aci-corp.org or 610-362-1200. Best regards, Cal
Electronics Forum | Thu Jun 29 14:29:25 EDT 2000 | Glenn Robertson
Leon - Remember for a CBGA you will need to use high-temp solder balls. IBM can supply the recommended solder paste (eutectic) volume. Glenn Robertson
Electronics Forum | Mon Jan 22 09:28:57 EST 2001 | Adam
The assembly is HASL finished. The colour of the solder mask is green, ( sorry I dont know the technical name ).The flux is No Clean (Koki JS3000)which is seeing a preheat temp between 90-100degCel. The solder pot is set at 250degCel and is 63/37.
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