Electronics Forum | Tue Jun 04 13:13:58 EDT 2002 | slthomas
Another thing we see is solder balls (sometimes fines, sometimes larger stuff) in the vias after a misprint has been poorly cleaned, as in wiped down but not washed. They end up in the plated through holes too, but those get nicely cleaned up in the
Electronics Forum | Tue Aug 05 17:19:18 EDT 2003 | Kris
Hi, Have you tried increasing the vibration at the main wave or using a chip wave? try increasing the temperature of the solder by about 10 Deg C.
Electronics Forum | Tue Dec 02 08:51:31 EST 2003 | Daniel Werkhoven
Dear Frank, could it be that your component legs are coated with a leadfree finish? This can have an inpact on soldering when your temp.peak in only 220�C and the melting point of pure Tin is 237�C. Best regards, Daniel
Electronics Forum | Wed Jul 28 00:12:48 EDT 2004 | NTV
It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).
Electronics Forum | Wed Jul 28 00:12:52 EDT 2004 | NTV
It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).
Electronics Forum | Wed Jul 28 00:12:58 EDT 2004 | NTV
It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).
Electronics Forum | Wed Jul 28 00:13:21 EDT 2004 | NTV
It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).
Electronics Forum | Wed Jul 28 00:13:23 EDT 2004 | NTV
It would be uncontrolled reflow process. Solder paste smeared, outdate solder paste, contamination, and many else could lead to this issue. A longer time reflow window would help elimating it (make it max. of 60 seconds liquid time).
Electronics Forum | Wed Dec 15 10:37:55 EST 2004 | gopinath A
Thanks Dave, That answers my question. I didn't think either that the qty of gold in platings would be enough to contaminate the solder pot. I wanted to make sure that leach test is a valid test for gold finishes. Gopinath@mcl.com
Electronics Forum | Mon Apr 04 09:26:25 EDT 2005 | russ
Depends on a lot of things as suggested above but we solder land to land spacings of .02" (.5mm) with no shorting. Russ
