Electronics Forum | Mon Jun 14 10:23:53 EDT 2010 | pcrane
I have CCA that has a SN100C HASL coating that I am wave soldering with SbPb. I have mounting pad areas on the CCA that are masked with a pallet during reflow so they are not exposed to the solder. The mounting pads are turning gray in some areas of
Electronics Forum | Tue Mar 21 16:25:23 EST 2000 | Boca
Full radius corners on pads can help with solder paste release in the stencil. The radius shape minimizes the surface area in the wall of the stencil aperture as compared to a sharp corners. When the stencil is seperating from the pcb the solder pa
Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
Electronics Forum | Fri Oct 22 11:37:38 EDT 1999 | Brett Gordon
Working DFM SMT issues with respect to a client's artwork together with a heavily modified solder stencil, I was able to reduce 0402 tombstoning from 80% across the board to 3%. I winged the aperture reductions, but are there any "rules" or guidelin
Electronics Forum | Mon Mar 29 04:00:01 EST 1999 | Vinesh Gandhi
Glenn, i am aware of one unique problem with voc free fluxes. since these fluxes have certain amountb of water content they cause sputtering leading to solder balls & voids problems. Regards Vinesh Gandhi | I require some feed back from any one
Electronics Forum | Fri Jan 24 09:26:29 EST 2003 | pjc
I sent you a couple of charts to assist with your troubleshooting. One is the Electrovert Wave Solder Troubleshooting chart and the other is Sandia Labs/Electrovert Optimum Solder Contact Time. Electrovert has a 6 deg. conveyor angle standard on the
Electronics Forum | Thu Jan 18 15:28:10 EST 2007 | CK the Flip
If you are, in fact, running a No-Clean solder paste: Different no-clean solder pastes will leave different types of (benign) residues. If your paste has been qualified from a Bellcore/SIR/Electromigration standpoint, any residues remaining will NO
Electronics Forum | Sat Mar 12 18:32:29 EST 2011 | jlawson
It is pretty hard to wave solder fine pitch parts bad enought with 0.5mm let alone 0.4mm It can be done but need N2 inert wave soldering & need layout design to accommodate this... Iy it is a QFP need to run part 45 deg into wave and if possible in
Electronics Forum | Wed Jun 06 15:59:25 EDT 2007 | chrisawallace
WML, I won't dispute math but I will definitely point out either bad math or a missed target. In your example, you are comparing "Energy used to heat the solder and keep it warm" versus "Energy used to keep the solder warm" and fully discount the fa
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
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