Electronics Forum | Wed Sep 08 01:10:30 EDT 2004 | alan
We have an issue with our Seho Wave solder machine. The machine is an 8040C, early 90's model. The problem is that continues to heat the solder up, even once it has reached its specified temp. If we set it for 250 degrees, it will go to 250 then c
Electronics Forum | Tue Nov 07 12:07:10 EST 2023 | tommy_magyar
We are mounting an microphone device (SMT package) onto a PCB - how? Surface mount line or hand soldering? Contamination can only come from the solder paste, solder wire, flux, or burning the component/PCB assembly during hand soldering. Unless the
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Wed Dec 03 07:26:35 EST 2008 | realchunks
Careful on fine pitch QFPs. They will be your weakest joint if your parts are no-lead. And don't think you can simply run a no-lead profile either. Depending on your paste, you cannot simply run your profile in the no-lead temps and expect your fl
Electronics Forum | Mon Feb 12 09:51:51 EST 2007 | rgduval
From what I see, you have a couple of options... 1. Hand solder the secondary side LED's. This is only a good option if you're going to be at low-ish volumes. Higher volumes tend to necessitate more automation to reduce production costs. However
Electronics Forum | Fri Mar 04 17:19:31 EST 2005 | davef
Mrduckmann2000: Why do you want to do this? * Removing a non-washable / peelable temporary solder resist [TSR] is going become very tedious, because they do not release well from small / tight / isolated features. * Clay from washable resists will
Electronics Forum | Tue Jul 15 22:50:12 EDT 2003 | iman
We have an internal engineering study on blowhole solder joints and had helped reduce the problem to pinholes symtoms. The pinhole occurs in solder joint of a Land-Grid-Array (LGA) side-wall (external perimeter of package) fillets. Our customer is a
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Thu Aug 16 20:11:21 EDT 2001 | davef
Hussman is correct. Make those people quit. [Just walk-up, pimp slap 'em, grab their dental pick, and say "Dave says you can't use this any more. I'm just following orders."][Trust me, this is much smoother than the "Tonya Harding Approach" that I
