Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
Electronics Forum | Thu Jun 06 13:17:33 EDT 2002 | Hussman69
Don't forget squeegee type and angle. (Am I an Ian wanna be or what?) I'd leave out different types of solder paste. For measurement, use something like a Cyber Centry. It may cost a little, but if you're serious, it's worth it. Other wise you m
Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech
Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu
Electronics Forum | Wed May 28 05:31:17 EDT 2003 | dougie
Hi, Can someone please give me an IPC standard number or similar for decal design when wave soldering SMT components on the underside of a board. Hopefully a document exists detailing design rules, the components ideal attitude to the wave, suitabil
Electronics Forum | Sat Dec 06 09:38:39 EST 2008 | eksoftware2
We are going to convert a Leaded Wave machine (EMS Stallion) to Lead Free. Can we just empty the pot of leaded solder, run it with pure tin for a bit and then put in SN100 bar? What's the score with SN100? Oh and does anyone have any paperwork for
Electronics Forum | Wed May 19 15:42:46 EDT 2010 | davef
Hear ya. Mostly, we production people. So, we shy away from home brew soldering techniques, unless we get ourselves in a mess. That being said, there's a fair amount of stuff on the web about home brew BGA and fine pitch QFP soldering. Here's an
Electronics Forum | Thu Jun 07 05:11:42 EDT 2012 | cp38260
Hi, I have pcbs (Duroid/RT 5880) with raw copper, soldered in vapour-phase chamber at 230 degrees Celsius. During soldering, copper gets tarnished. Cleaning with Vigon A250 removes the tarnished layer. Indeed, in the VigonA250 techn. datasheet it is
Electronics Forum | Tue Dec 15 10:16:55 EST 2015 | mbb
I had a problem with PCB pads: soldering process couldn't be performed because soldering pads of component in the PCB are oxydized. Is there any solutions to eliminate the corrosion on the pads in order to avoid there scrap because we 're talking abo
Electronics Forum | Thu Apr 27 21:20:38 EDT 2000 | Dean
Here are some pointers to use during your X-ray inspection. Microcracking is virtually impossible to determine with X-ray. However, I suspect you are looking for "hard" opens. Those are much easier to find visually. If using a paste-and-place pro
Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
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