Electronics Forum | Thu Apr 29 16:56:16 EDT 1999 | Kevin Hussey
| | We are an assembly house engaged in large volume manufacturing of Computer motherboards and others. We are in the process of selection of a new wave soldering machine. Can somebody help me inform what are the different parameters which must be e
Electronics Forum | Wed Sep 29 14:57:13 EDT 2010 | asksmt
What is difficult about hand soldering your SMT part? Production solder All SMT packages by reflow Process and not by hand solder. because they think if they use hand soldering on SMT package- Soldering quality can’t be ensured as this is SMT parts
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Mon Sep 17 09:47:18 EDT 2012 | mbnetto
Hi, Do you want to replace the SB ou just reflow it again? Do you suspect there is some "colder solder joint" in one of the SB balls ? In my opinion you are heating the board a lot... Did you put some thermocouple on the ball to check the temperat
Electronics Forum | Fri Mar 01 08:35:27 EST 2002 | caldon
I am on board with Dave F.(like I usually am). I can not imagine what IPC specs the auditor is speaking about. The Stencil Design criteria, 610, and 001 do not fit the type of solder deposition you speak of (nor I think they should). The machine para
Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan
Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s
Electronics Forum | Mon Aug 14 01:29:49 EDT 2023 | calebcsmt
I have noticed on a recent project, the QFN and SOP solder deposits do not seem very uniform and have been leaving little balls, whiskers and icicles of solder paste coming from some pads which leads to bridges. https://imgur.com/a/lqw5RF1 I have u
Electronics Forum | Fri Nov 25 14:52:50 EST 2011 | davef
Sn43/Pb43/Bi14 is a low temperature leaded alloy that has been used with very good success. The low melting point helps avoid some thermal shock issues on some assemblies. A word of caution, this alloy forms a low melting point at approximately 95*C.
Electronics Forum | Fri Dec 01 01:42:09 EST 2000 | PeteC
I recommend paste print-reflow the bottom side then use a selective wave solder pallet to mask the SMT components on the bottom side. PeteC
