Electronics Forum | Sat Jul 03 00:58:57 EDT 2004 | KEN
so what did we do before X-ray? sound process shouldn't need to rely on inspection. Extended soaks can be used to burn off high temp volatiles but I have never heard of 5 minutes! I have used 90-120 sec. to reduce solder splatter....but haven't do
Electronics Forum | Wed Feb 28 09:53:17 EST 2001 | fkurisu
Hello Dave, Solder mask rework has been performed on both bare and populated boards. There are factors that come into play with a populated board that make this type of rework more difficult, such as the density of components(especially around th
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
Electronics Forum | Wed Jul 03 07:40:48 EDT 2002 | Yannick
Hi, WE are making some test with this kind of component and aperture and here what we think. when you use a home plate aperture it's seem that the component is not lenght enought to have a good solder but maybe is our CAD guy that didn't make a
Electronics Forum | Mon Oct 06 10:04:29 EDT 2003 | davef
Excess low residue flux is very dangerous to leave on your finished assembly, because it can: * Be corrosive to your solder connections * Promote dendrite growth. To prevent this, follow your supplier's recommendations on: * Applying the proper amou
Electronics Forum | Tue Apr 03 08:38:34 EDT 2012 | tombstonesmt
Yesterday morning wasn't the first time I noticed this condition. We remove the dross from the pot twice a day and once a week we remove the pump assembly and it still produces this type of dross. I googled this situation and some factors of this par
Electronics Forum | Mon Nov 24 10:41:29 EST 2003 | ilona
Hi, there is also a German company making odd-shaped component insertion equipment, actually very very suitable for LED placement and soldering in the same process cycle. LED's are held in position until soldering is complete, straight and in the s
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Fri Aug 13 00:08:16 EDT 1999 | FMung
| | | Hello, | | | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | | | B.Regards, | | | Felix | | | | | I have a process cause and eff
