Electronics Forum | Fri Oct 29 02:07:48 EDT 1999 | Eom In Soub
hi. guys Have you out there ever seen the crack by means of humidity after reflow solering. We cannot analyze the cause of the tsop crack. The shape of crack seem to be hitted by sharp stuff. but there is no scar around crack . TSOP shaped long rec
Electronics Forum | Fri May 21 11:59:24 EDT 1999 | John Eramo
Has anyone had any experience or data using vibration during the reflow process. We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked very
Electronics Forum | Wed Jan 17 18:42:49 EST 2007 | Richard
I'm trying to get an even solder coating onto a retangular shaped ceramic substrate (5.0mm x1.83mm), but the solder tends to pool on the short side of the substrate.
Electronics Forum | Tue Mar 09 12:57:43 EST 1999 | Jan Pasternak
I want to identify a pre-production prototype test house to evaluate new parts in the Chicagoland area. Capability of running high speed pick and place and soldering components to test board.We will submit boards and parts.
Electronics Forum | Wed Jul 02 19:06:21 EDT 2003 | Adrian Espinoza
Last week on my company we began a production for new model. Today we identify a possible non-conformance solder appareance. I have a picture for this defect to show the condition.
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Mon Feb 02 17:52:11 EST 2004 | swagner
We are not having a problem, we have a customer that would like us to use post reflow AOI to inspect the solder joints to class three. I would like to see if anyone is having sucess doing this.
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
Electronics Forum | Sun May 23 10:14:14 EDT 1999 | M Cox
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Mon Feb 02 22:01:24 EST 2004 | Dean
I find this disturbing when customers dictate your process and equipment? Your responsibility is to deliver a quality product on time. Why would your customer care HOW you achieve this? Hence the success of Chinese manufacturing. I have one custo
winsouce.jpg)