Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Mon Jun 01 17:49:39 EDT 2009 | gregoryyork
Sorry looking at your profile again and considering its Aluminium substrate I would opt for an increase to the preheat or introduce a soak to the profile to get the PCB up to reflow. Try soaking between 175 - 200C sufficient enough to heat the whole
Electronics Forum | Thu Mar 25 13:31:42 EST 2004 | Ren�
Hi Daniele: In a design of experiments with four methods for attaching thermocouples : High Temperature Solder, Aluminum Tape (Chomerics T405), Kapton Tape and Conductive Epoxy (Loctite Tak Pak 382. The most reliable method is high temperature solde
Electronics Forum | Wed Apr 22 05:33:06 EDT 2015 | mbb
We'have been working on an issue regarding aluminium capacitor placement in PCB. In fact, we have twisted (shifted) capacitors. Through root causes analysis, we confirmed that this phenomenon is happening during reflow process (no issue on placement
Electronics Forum | Tue Sep 15 06:16:35 EDT 2009 | geb
Hi, We're using solder paste opposed to solder wire for hand soldering certain components. We are also using high temperature soldering irons with 450deg C tips as we are soldering onto aluminium (IMS) PCBs. The quantity of tips which we go through
Electronics Forum | Thu Apr 29 04:34:07 EDT 2004 | allsmt
Dear Sir's, we had become an inquiry from an customer of allSMT, who is in need of an Machine which can solder via Laser? does anybody has experience with this procedure? I will try to explain the project. The pcb is an Aluminium pcb. There must
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Wed Apr 22 09:32:36 EDT 2015 | mbb
Thank you for answering, Yes, we have 3 different capacitors for each daughter board with 4 boards/PCB. Another information that could help that we have the issue randomly on boards (not a specific one). The occurance of the issue is random. yes,
Electronics Forum | Tue Jun 12 02:58:53 EDT 2007 | d0min0
HI, thanx for opinion ;) tried Searching but obviously did some mistake in 'words' and got 0 results ;p I've already tried high temp solder - but it's damn difficult to solder TC to the component... I'll try aluminium then...but from what I rememb
Electronics Forum | Wed Apr 22 10:08:52 EDT 2015 | emeto
I assume you are running Lead paste and that is why your parts are moving during reflow. Most probably these caps have leads that are bended in random directions(look at some parts from the bottom and observe how symmetrical the leads are). In additi
