Electronics Forum | Mon May 24 16:34:03 EDT 2004 | Mark
I just got a report from MacDermid on Solder Mask Interface Attack Issue (SMIA) with Sterling Silver Process. Corrosive chemicals in the ImAg process get trapped under the soldermask edge and eat at the copper trace. They are experimenting with diffe
Electronics Forum | Thu Sep 02 21:51:54 EDT 2004 | davef
Curious, but thoughts are: * Your pretinning pot is loaded with gold that has been removed from lead over a period of time * Your failed solder connections are caused by something else other that gold intermetallics * Your tinning process is undiscip
Electronics Forum | Sat Nov 06 08:20:16 EST 2004 | GS
In addition, if PBA is assembled by No Clean paste or flux, you could have some color changes un PCB, on solder joit, on component body, etc. But just a cosmetic pbm. Rgds
Electronics Forum | Wed Mar 30 16:28:12 EST 2005 | Guest
Aluminium tape adheres quite well and is not intrusive. I believe it's mentioned in KIC's articles as a good alternative to high-temp solder.
Electronics Forum | Tue May 03 09:18:42 EDT 2005 | denismeloche
Call me and I will give you a company that will take your solder for disposal at no cost. Den, Manncorp 215-830-1200
Electronics Forum | Fri Feb 24 06:42:08 EST 2006 | SIR
What is the IPC norm wich drives the IPC stencil aperture design? The contest is: a stencil for the deposition of solder pastes on bare boards Thanks
Electronics Forum | Thu Apr 06 10:21:40 EDT 2006 | patrickbruneel
Copper dissolution is a major issue in lead-free soldering, but only when you use OSP boards. Nickel based plating eliminates the problem.
Electronics Forum | Fri May 12 06:04:24 EDT 2006 | slaine
Multicore, indium, and to be honist most other solder manufactures should still sell it for quite a few more years
Electronics Forum | Fri Jul 28 08:28:14 EDT 2006 | davef
Solder paste mixer * Malcom [malcomtech.com] SPS is a non contaminating mixer which utilizes pseudo planetary motion * Japan UNIX [japanunix.co.jp] Uni-Cyclone UM-103 * Genitec [genitec.com] GAM60 * Synergy Engineering [synergymark.com] Unity 500
Electronics Forum | Wed Mar 21 17:08:34 EDT 2007 | iit
The biggest problem with double printing is that if the squeegee pressure and speed are correct, the stencil apertures are already filled with paste. Printing again can force paste between the bottom of the stencil and the top of the board creating
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