Electronics Forum | Mon May 22 03:24:37 EDT 2006 | slaine
Hi below is a link to a database set up that list the properties of all SAC alloys, worth reading. http://www.europeanleadfree.net/POOLED/DOCUMENTS/a178886/ELFNET_COST531_Solder_Alloy_Properties_Database_v1.pdf its from http://www.europeanleadfree.
Electronics Forum | Fri May 26 09:49:34 EDT 2006 | pjc
This question cannot really be answered definitively here. There are unknowns such as your board design and solder land finish. I suggest you conduct a DoE (Design of Experiments) to determine paste print deposition X-Y-Theta tolerance for your appli
Electronics Forum | Tue Nov 02 08:36:51 EDT 2010 | rgduval
Michelle, Our experience with no-clean solder pastes has been that water washing a mis-print is a bad idea. We've found that DI water does not do a sufficient job removing the no-clean paste (the same goes for stencils). Instead, we have washed no
Electronics Forum | Thu Jul 18 13:11:56 EDT 2002 | gdstanton
Steve, We are touching up 6 - 12% of all solder joints processed. We consider the solder joint to be the focal point of the SMT process. Therefore our metric is based on it. For example in a given month we... 1. Assembled 25pcs of 'A' (IPC-A-610/J
Electronics Forum | Thu Jun 14 08:49:24 EDT 2001 | anders
We have to perform a wire modification on a PCB. I am looking for a wire where the insulationmaterial does not shrink or melt when soldered.
Electronics Forum | Thu Aug 03 10:46:16 EDT 2006 | John S.
We've had a customer request that we check the PPM level of oxygen at our wave solder's inerters. I'm looking on the web, and there seems to be a huge variety of these instruments. Can anyone make a recommendation on one that is working for you? T
Electronics Forum | Wed May 30 10:09:39 EDT 2012 | brettrenishaw
Recently we have noticed a purple-blue colour film on the surface of the molten solder. It can be cleared when de-drossing the pot. The pot will normally go a yellow/gold colour before it turns purple-blue. Is this most likely an oxide of the tin or
Electronics Forum | Fri Jun 19 09:10:20 EDT 2015 | kenkay
What is the best way to clean a bad print on a board of no-clean paste? We have tried a few different ways but always seem to get left over solder balls
Electronics Forum | Wed Oct 23 16:17:17 EDT 2002 | nwyatt
CSP is similar to BGA process in that you need to undergo a reflow process to properly solder the chip. Also, a soak period is desirable to promote outgassing. You do not need nitrogen. We are building CSPs in a regular convection oven without n
Electronics Forum | Fri Dec 21 09:20:36 EST 2007 | operator
Hello All, I read AIMs article "Time Above Liquidus". It was very informative and a good read. One thing that the article didn't touch on, that is a mystery to me, is thermal shock to components during the ramp up stage of a profile. If you
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