Electronics Forum | Mon Jan 25 21:43:04 EST 1999 | Dave F
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Thu Apr 28 08:29:22 EDT 2005 | andymackie
If what you are talking about is "assembly materials", then consider the following: - Solder paste - Wavesoldering fluxes - Bar (for filling wavesolder pots) - Underfill (for TCE-mismatched CSP's and flip-chip) - Cleaning fluids (for post-reflow boa
Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Thu Aug 24 16:59:11 EDT 2000 | Dr. Ning-Cheng Lee
For reflowed solder joints, Bi bearing solder has been reported to exhibit superior fatigue resistance. It also provides better wetting than many other alternatives, including SnAgCu systems. In my opinion, it may be the choice once all Pb can be pha
Electronics Forum | Mon Aug 10 11:58:33 EDT 1998 | Wayne Bracy
| | I am trying to get an idea of what system seems to work best for solder paste inspection. I am looking for basic table top models with he capabilites of height and width measurements. Can anyone give me suggestions, pricing and why you prefer
Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution
I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i
Electronics Forum | Fri Jan 11 16:33:59 EST 2008 | mgershenson
We have 30 years of soldernig experience, 25 years in soldering robotics, and have had laser based systems for a few years now. I'm not sure you need a laser for this application. It's really going to depend on whether or not an iron tip can get in
Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef
A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
