Electronics Forum | Thu Sep 24 12:59:59 EDT 2020 | davef
If whatever is preventing the leads on your component from wetting is oxidation, cleaning the component will not help. Consider trying a more active flux prior to soldering. Understand from your supplier the potential complications that may affect
Electronics Forum | Tue May 03 15:15:33 EDT 2005 | dphilbrick
The biggest problem is getting paste on the board. We ran a board that had 8 per and would get an occasional insufficient solder joint. I would look into doing the boards with something like a SiPad process (www.sipad.net) My $0.02
Electronics Forum | Wed Apr 19 07:45:50 EDT 2006 | Carol Stirling
Sorry about that. I'd like to post a picture but doubt it's possible. Baseball cap = The pad solder reflows but the BGA ball and the pad don't reflow together in a continuous elliptical shape. Carol
Electronics Forum | Fri Nov 21 09:29:11 EST 2008 | saintete1304
Hi , i desire to find the type of information : When the Soldering must be performed after baking for the PWB to not have a POP problem link to the moisture ? And the time for a flexible PWB ? thanks best regards
Electronics Forum | Fri Apr 20 21:16:29 EDT 2018 | sarason
And if it is a hard rubber nozzle for a large IC make sure it is still pliable. And solder paste isn't stuck up the end of your nozzle sarason
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Tue Feb 24 09:52:14 EST 2004 | davef
First, two points about hole / barrel fill are: * A filled hole is an excellent indicator of the optimum process and optimum quality PCB. * The study that showed that holes need not be filled was paid for by the US Army and performed by Lockheed in
Electronics Forum | Tue Apr 01 09:03:39 EST 2003 | kmorris
Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these critters. The part we are using is a Semtech SH3000
Electronics Forum | Fri Aug 04 16:11:59 EDT 2006 | chrisgriffin
Hell Doc, This is an easy one. But first I must disagree with the wave master. I have done extensive refurb. jobs on Soltec and Vectra. The only thing Soltec has on Vectra is a better solder pot, and even that is close. Vectra software is many, m
Electronics Forum | Thu Jan 13 10:30:40 EST 2011 | bdamico
Hello Scott, Simply program the side angle cameras as you would for any other device using the downward camera. For instance, solder joint inspection for a PLCC would utilize a basis window, bridge inspection algorithm and individual solder joint i
