Electronics Forum | Thu Mar 10 14:31:57 EST 2005 | russ
Patrick told you why, But here is some more info for ya, I would absolutely not recommend that wires be tinned with OA. The residue will never get cleaned underneath the insulation and all of your strands will strt to break in the near/far future.
Electronics Forum | Thu Mar 10 13:05:41 EST 2005 | patrickbruneel
This phenomenon is caused by a high amount of halogens (Cl, Br etc.) used in the flux activators or in the flux surfactants. We've seen effects creating all colors of the rainbow. Changing to No-Clean (halide-free) will eliminate this color effect.
Electronics Forum | Thu Mar 10 10:06:08 EST 2005 | steve
OK all you Gurus here's one for ya. Customer is tinning wires with standard eutectic solder in a solder pot. There is a blue tint to the solder in the pot. After tinning with OA flux, which I will change to NC shortly, he has clear teflon insulation
Electronics Forum | Thu Mar 10 15:43:06 EST 2005 | steve
Thank you both for your assistance. I knew that I could count on you folks. The customer has purchased No-Clean flux and is using it as we speak. Hows that for customer service.... All in a days work... Thanks again You make me look good!!! Steve
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator
The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
