Electronics Forum | Tue Apr 10 13:43:13 EDT 2001 | mparker
since you did not define what visual process you are inspecting with I will ask is this "grainy" appearance being detected with the naked eye only? Are you using magnification? if so, what power? Is this a SMT solder or through hole solder problem?
Electronics Forum | Thu Aug 10 12:14:12 EDT 2000 | Charles
It looks like a giant dpak device but with 5 leads. The problem is that on approx 3% of our boards one more pins are open circuit. It appears that the pins are not in contact with the pads. Board is HASL finish IR oven Paste Koki 953i. If you have a
Electronics Forum | Thu Jan 04 15:39:07 EST 2007 | dyoungquist
While the 85% yield on a per board basis seems low, we are actually running over 99% yield on a per solder joint basis as there are about 17,700 joints per panel. On average, 9 out of 63 boards in the panel need rework. Rework issues include missin
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Thu Feb 14 10:59:37 EST 2008 | stevezeva
Maybe what you could do is have the stencil contain a tightly spaced mesh or grid of openings over the ground plane areas that you need to be solder covered. Also, to help the solder flow out better, you might want to decrease the percentage of metal
Electronics Forum | Thu Jul 19 22:12:52 EDT 2001 | davef
We don't use the connector that is giving you soldering problems. Regardless, no one here is taking bets that you'll get pay-back from increasing the length of the locking pin. If it makes you feel any better, we'd bet against a 4-40 flat head and
Electronics Forum | Thu Aug 27 11:08:30 EDT 1998 | Richard Scarcelli
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Fri Aug 28 12:49:24 EDT 1998 | Earl Moon
| | | Would like to know the following information on processing micro bga's: | | 1) Fine mesh solder paste .vs. tacky flux --- which is best | | 2) Stencil thickness for solder screen | | 3) Aperature size for standard pitch balls | | 4) Which
Electronics Forum | Fri Jul 24 16:03:56 EDT 1998 | Boris Akselrud
Dave, Thanks for your responce. I think I can manage to solder components by hand. But I am trying to find out an alternative way to solder them. The distance between leads becomes very small and if solder gets in between them I will have hard times
Electronics Forum | Wed Jan 27 19:42:34 EST 1999 | parag palshikar
i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperature a
