Electronics Forum | Fri Apr 20 16:05:17 EDT 2001 | gcs
We always reduce side to side, EXAMPLE: 12 mil width reduced to .010". Do you guys check viscosity ? Also maybe your guys are appling to much pressure on the sqweegee blades.
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew
We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact
Electronics Forum | Fri Apr 20 08:41:56 EDT 2001 | jimlew
For those of you out there, like myself who are still using 2-d to measure paste ht, I have 2 questions. 1. Typically, what tolerance are you applying to your ht? +- 1 mil, or what? 2. Are you using metal squeegees, and if so, have you found that squ
Electronics Forum | Thu Oct 02 01:47:57 EDT 2008 | myleb
I'm new to SMT. Now, i'm making program for SPI machine to inscpect for solder paste of SP60-MU. I think this is a very good printer but some times, my program shows only 50-60% of volume transfer; and the average height is very high: nearly 200 pct.
Electronics Forum | Thu Oct 02 17:00:44 EDT 2008 | davef
Is that accurate? If so, what are your aspect & area ratios? [Similar to the JerryS comment above.] * You say, � � and the average height is very high: nearly 200 pct.� => Our troop can make paste that height too. They snap the stencil-off a fast as
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Fri Jan 28 12:18:32 EST 2005 | Chunks
Your best bet is to do a decision making matrix. Each company has so many different criteria�s it's hard to pick out which one might be important to yours. Simply pick out your top 5 paste manufactures. Next decide what your "Eliminators" are - th
Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG
Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more
