Electronics Forum | Tue Jun 06 17:00:36 EDT 2006 | pjc
Be carefull of the effect on other components with a 7mil stencil, like fine-pitch devices will bridge more, excess solder.
Electronics Forum | Fri Jun 02 08:50:47 EDT 2006 | russ
Hmmm interesting, we utilize 5 mil stencils and print to same height as you and do not experience these failures. May I ask what paste you are using and what the spacings are of your pad design? But anyhow, if it works it works.
Electronics Forum | Sun Jun 04 21:05:56 EDT 2006 | ec
Hi Russ, I could not send any attach file using smtnet.......anyway thanks your input.
Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Thu Jun 01 21:19:52 EDT 2006 | ec
Hi Russ, Thanks for your input. Currently, our stencil is at 5 mil thickness and the paste height from 5.5 to 6.5mil. I have increase the paste height to 7 to 7.5 mil and great improve....... I just need some data to present to my management and tel
Electronics Forum | Tue Oct 26 16:51:18 EDT 1999 | John Thorup
Hi nards I'm not quite sure what your question is. If you mean is paste volume more important than the reflow profile the answer is no. Belt speed is just a part of creating a reflow profile and all aspects I.E. pasting, placing and reflow are jus
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue May 20 12:20:18 EDT 2008 | danimalz
Does anyone have an easy way to estimate how much solder paste is applied to a smt pcb? I understand it varies on squeegee pressure, stencil thickness, and pitch of the components but I was looking for an average. I would assume that somewhere out th
Electronics Forum | Thu Feb 10 20:02:24 EST 2011 | bandtank
Thanks for your advice. My business model is fine, but I just find it to be unreasonable that there isn't a "no frills" oven below $3500 that maintains quality. I'll spend that much if I have to as I don't want to mess around with bad solder joints o
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