Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F
Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f
Electronics Forum | Tue Nov 09 19:45:48 EST 1999 | Steve Thomas
1 Money IS an object, and my boss will be thrilled. The stencil manufacturer recommended ovals to facilitate better release. Seems likely to be true, but whether or not it's necessary I don't know. We have perpendicular walls on these (6 mil) ste
Electronics Forum | Mon Aug 02 11:47:35 EDT 1999 | Mike Lare
Just wanted to thank everyone for your inputs. This info will at least give me a decent starting point.
Electronics Forum | Wed Jul 28 22:06:17 EDT 1999 | Dave F
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Fri Jul 30 15:41:16 EDT 1999 | M.L
| | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly a
Electronics Forum | Fri Jul 30 15:22:52 EDT 1999 | M.L
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Thu Dec 05 11:04:27 EST 2002 | slthomas
They're IR, bottom side only. Frankly wave solder is not my forte (there are those that would claim nothing is), but I've personally been tasked with developing a process to do reliable, high volume bottom side SMT, so I'm drawing a lot from the tec
Electronics Forum | Fri Jul 15 16:50:04 EDT 2005 | davef
Few of us here on SMTnet fabricate our bare boards. Most of us are assemblers. So, the solderability of the connections of our boards is a BIG issue with us. Our suppliers protect the solderability of the copper by coating the copper to limit the
