Electronics Forum | Thu Jan 02 10:31:48 EST 2020 | slthomas
It is strange that you're having issues while using the same process parameters (including stencil) that worked successfully before. It doesn't guarantee that it's not one of those parameters changing in a manner that's not apparent, but it does sugg
Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 16:48:05 EDT 2002 | russ
Where are they at, and what size?
Electronics Forum | Tue Dec 31 01:35:44 EST 2019 | agoesfirmanto
Dear Sir, Thank you for your response. I show you the picture
Electronics Forum | Thu Jun 10 19:20:59 EDT 2021 | kojotssss
Hi, Too much paste on grounding pad. Looks like also doesnt have path for gases, for void escaping.
Electronics Forum | Tue Jun 04 22:54:32 EDT 2002 | davef
Solder balls are one of the most popular topics here on SMTnet. Search the fine SMTnet Archives for background. We like to wash solder balls from the board in our cleaner.
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
Electronics Forum | Tue Dec 31 02:06:21 EST 2019 | sssamw
Yes, from the picture, it seems the gap between solder pad is very small, easy to have solder ball/solder bridge.
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