Electronics Forum | Thu Aug 24 14:42:30 EDT 2006 | any
y we had solder ball after reflow owen?
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Thu Nov 30 08:09:19 EST 2006 | INGE
Hi everybody, The matter is this: after reflow, on top side leads of chip components (resistor 0805)appear some empty balls of solder. In some cases this thing is only on the lead and the solder joint seems good, in other cases this empty ball is als
Electronics Forum | Sun Feb 06 12:04:06 EST 2005 | ddhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Tue Feb 08 06:43:56 EST 2005 | dhanashekar
we have even tried with 6mil stencil even than we are getting the solder ball thanks for your suggestion
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Mon May 10 11:24:33 EDT 2004 | Charly
Encounter solder ball crack after reflow, found the solder ball is out of shape after reflow, cross section view found that the solder mask opening is not good ( when we do comparason with diff. supplier substrate.) Does the solder mask shape will af
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
