Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Mon Nov 15 15:27:48 EST 2004 | davef
In creating your solder balls, consider printing or dispensing solder paste on the pads of the LGA and then reflowing the paste.
Electronics Forum | Mon Nov 15 14:26:11 EST 2004 | nrocco
also the balls need to be lead free, just to make it more interesting.
Electronics Forum | Tue Nov 23 08:49:08 EST 2004 | zanolli
Please contact me offline and I can discuss methods of attaching solder balls to stamped metals contacts �on the fly� while the contacts are still continuously oriented or in reel form. Regards Jim Zanolli Teka Interconnection Systems Phone: 401-785
Electronics Forum | Thu Nov 18 09:25:42 EST 2004 | pjc
Vanguard is a ball placement machine. They are out on Long Island NY and manufactured by White Eagle Engineering. The contact person is Pete Heinzl 520-791-0239, pheinzl@whiteeagleeng.com
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Wed May 27 13:24:51 EDT 2009 | ck_the_flip
These are becoming extremely popular at my company. I have searched the SMTNet archives and found this: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7575&#Message30119 Has anybody used other attachement methods?
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
