Electronics Forum | Tue Sep 23 20:56:08 EDT 2008 | davef
For additional information, download IPC-7526 - Stencil and Misprinted Board Cleaning Handbook http://www.ipc.org/html/IPC-7526.pdf
Electronics Forum | Tue Sep 23 07:27:31 EDT 2008 | realchunks
Do not wipe the board at first before putting it in your cleaner. It will leave more paste in your tank, but you won't smear it into every corner of your solder resist. We found that only our stencil cleaner would clean a board properly and leave n
Electronics Forum | Thu Sep 25 17:44:37 EDT 2008 | gregoryyork
strongly agree dont wipe at all, we make an air operated cleaner which blows the powder off while immersed in solvents to break up the flux. cheap and effective as long as you dont wipe first
Electronics Forum | Thu Sep 29 19:18:24 EDT 2005 | HLy
Hi, I noticed that the solder joints on my BGAs end up with a lot of wrinkles after reflow. See picture at: http://pstr-r02.ygpweb.aol.com/data/pictures/02/01A/17/DD/E3/9E/n8BhepQLFDs6GMSwaRNxPCTWR5NdpUJZ0300.jpg Does anybody have any ideas what cau
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef
Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.
Electronics Forum | Sun Sep 21 10:03:15 EDT 2014 | gascon5383
hi, there is an IPC standard, IPC-A-610 - Acceptability of Electronic Assemblies. According to this manual, solder in the bends of a lead does not matter, but solder touching the body of a component is a defect. I cannot find a specific reference in
Electronics Forum | Wed Aug 19 16:28:03 EDT 2015 | mdeley
Looking for a Santa Clara area contract service with capability to attach 15mil dia. solder coated Cu balls, ideally on a 12" x 18" PI panel, small job to start. T&R services are a plus. My initial search is coming up with device/component level r
Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont
Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en
Electronics Forum | Thu Feb 08 08:28:11 EST 2007 | mzaboogie
Good Morning Everyone, We have an application coming up with several BGA's on a RoHS assembly. One is a 25 mil ball on a 40 mil pitch, another is a 15 mil ball on a 40 mil pitch. In the past for leaded assemblies, we have used square apertures for 1
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