Electronics Forum | Mon Oct 19 07:39:15 EDT 2009 | m_imtiaz
Hi, We are facing solder ball problem in manual soldering process (between wire and terminal). we are using no-clean solder (63:37)and temperature setting in iron is around 400 Cel. Can any one suggest me how to solve this problem Any thoughts would
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef
Can you jumper the via to the pad?
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Thu Mar 24 18:05:54 EDT 2011 | nkinar
That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?
Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef
Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.
Electronics Forum | Sun Jun 01 03:42:49 EDT 2014 | sync40
Hello to everybody in this forum, I would like to know any information that you kindly may have about the following subject: We very often do manual soldering assembly of immersion tin finished PCBs. Since thiourea is used in the formulation of the
Electronics Forum | Mon Jun 02 15:09:10 EDT 2014 | davef
I've never heard of anyone affected by thiourea during assembly soldering operations. I believe the greatest concern of exposure to thiourea is during the board fabrication process. BR ... davef
Electronics Forum | Mon Jun 02 15:51:17 EDT 2014 | sync40
Thank you so much again davef for your new reply. This past weekend I was looking for more information regarding this subject, but, as you stated there is no information about thioruea concerns during assembly soldering operations, mainly focused in
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