Electronics Forum | Fri Feb 03 11:47:29 EST 2017 | lleonard
Is this for a Selective Solder? If so what size nozzle do you run. I run at 315 C most of the time. You can speed up your process time and still achieve good solder fill.
Electronics Forum | Fri Feb 24 02:04:50 EST 2017 | soldertraining
Selective Soldering Frames can pull large amounts of heat from the solder wave at the point of contact, effectively lowering the temperature of the solder at the solder joint. You should confirm the temperature of the solder joints by running a therm
Electronics Forum | Thu Jun 23 22:30:31 EDT 2005 | wjxingggg
poor soldering of PCB. > unfit stencil hole of QFN > incoming problem for this component >...... What is your opinion? or what can I do for the next step? Thanks again.
Electronics Forum | Wed Jul 06 08:41:06 EDT 2005 | james
What I have seen too is that these parts normally come in a tube and from moving in the tube some of the copper starts to expose and solder will not adhere to these parts. Let me know if anyone else sees the same problem.
Electronics Forum | Thu Feb 02 11:01:57 EST 2017 | charliedci
Maybe increased barrel fill? Raising pot temps slightly seems to increase barrel fill at selective solder, something we battle with.
Electronics Forum | Thu Feb 02 15:26:00 EST 2017 | davef
I'd expect pot temperature to affect components and bare board performance before affecting the solder connection
Electronics Forum | Mon Feb 06 22:38:46 EST 2017 | david_chiu
No matter in selective soldering or wave soldering process, higher pot temperature and longer wetting time can increase IMC thickness and joint strength(reliability), but as Daivf said, you need to care if the DIP component and bare PCB was damaged b
Electronics Forum | Wed Jul 06 12:25:55 EDT 2005 | HOSS
Bob, We have seen this same issue and haven't found a solution other than touching up to create a toe fillet. Luckily, it's a low volume product, for now. What have you done to combat this? Thanks.
Electronics Forum | Fri Feb 03 07:09:02 EST 2017 | emeto
Dave, what do you mean affect the board? Any literature on the subject here in the forum or any at all?
Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
