Electronics Forum | Sat Feb 06 07:17:47 EST 2021 | agoesfirmanto
Hello Pak Zack. very sorry late reply Thank you for your sharing. Solder ball issue already solved. Best regards, Agoes
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 16:48:05 EDT 2002 | russ
Where are they at, and what size?
Electronics Forum | Tue Dec 31 01:35:44 EST 2019 | agoesfirmanto
Dear Sir, Thank you for your response. I show you the picture
Electronics Forum | Thu Jun 10 19:20:59 EDT 2021 | kojotssss
Hi, Too much paste on grounding pad. Looks like also doesnt have path for gases, for void escaping.
Electronics Forum | Thu Jan 02 22:23:54 EST 2020 | jakapratama
Hello Pak Agus, Was there perhaps a change in solder paste? There has been confirmed occurrence in your case which happened in the work place I was before; all same parameter, equipment, material, and suddenly solder ball outbreak happened across al
Electronics Forum | Tue Dec 31 02:13:14 EST 2019 | agoesfirmanto
This PCB model has been in production since 2018 and stopped production almost 1 year ago, now it has started production again and I found this problem. at the time of production in 2018 this problem did not occur. while the parameter settings do not
Electronics Forum | Thu Jan 02 07:04:57 EST 2020 | dontfeedphils
Pretty large solder-ball. Looks like it may have come from the ground pad since it's so large, in which case I would reduce the print coverage on the middle/ground pad and see how it works for you. You verified that these parts have the groundpad a
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